Low temperature and low pressure fluxless Cu-Cu bonding by Ag-based transient liquid phase sintering for high temperature application

M. Khairi Faiz, Takehiro Yamamoto, Makoto Yoshida

研究成果: Conference contribution

抄録

This work is the first to achieve a low temperature (≦250 °C) and low pressure (≦0.1 MPa) fluxless bonding of plateless Cu-Cu substrates by transient liquid phase sintering (TLPS) of Ag nanoparticles and Sn-Bi eutectic powder. Sintering was conducted under formic environment to assist the wetting of Sn-Bi and to suppress the oxidation of Cu substrate. Effect of mixture composition to the shear strength, microstructure, and remelting temperature was investigated. The effect of formic gas environment to the shear strength and microstructure was also examined. It was found that shear strength of 30wt% added Sn-Bi (Ag-30SnBi) that was sintered at 250 °C was higher than 20 MPa, which is comparable to the conventional Pb-based solder. The determined remelting temperature by differential scanning calorimetry (DSC) test was found to shift to higher temperature compared to the Sn-Bi eutectic temperature, implying the possibility of high temperature operation. Formic gas environment was observed by SEM to assist the densification of the sintering microstructure by the reduction of the oxide layer on the sintering structure and subsequently promoting the formation of sintering necks.

本文言語English
ホスト出版物のタイトル2017 IEEE CPMT Symposium Japan, ICSJ 2017
出版社Institute of Electrical and Electronics Engineers Inc.
ページ195-198
ページ数4
ISBN(電子版)9781538627129
DOI
出版ステータスPublished - 2017 12 26
イベント2017 IEEE CPMT Symposium Japan, ICSJ 2017 - Kyoto, Japan
継続期間: 2017 11 202017 11 22

出版物シリーズ

名前2017 IEEE CPMT Symposium Japan, ICSJ 2017
2017-January

Other

Other2017 IEEE CPMT Symposium Japan, ICSJ 2017
国/地域Japan
CityKyoto
Period17/11/2017/11/22

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料

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