Low-temperature anodic bonding using lithium aluminosilicate-β-quartz glass ceramic

Shuichi Shoji, Hiroto Kikuchi, Hirotaka Torigoe

研究成果: Article査読

53 被引用数 (Scopus)

抄録

Silicon-to-glass anodic bonding is performed at temperatures below 180°C using lithium aluminosilicate-β-quartz glass ceramic. High alkaline ion mobility at low temperature, which is required for bonding, and thermal expansion coefficient matching to Si are realized by controlling the composition of the glass ceramic. Bonding is obtained at a lowest temperature of 140°C. Useful bonding conditions are temperature above 160°C (applied voltage above 500 V). Since the etch rate of the glass ceramic is five times higher than that of Pyrex glass in HF wet etching and the undercut is very small with a Cr-Au etch mask, three-dimensional structures are easily fabricated. Low-temperature anodic bonding using this type of glass ceramic is useful for the packaging and assembling of MEMS.

本文言語English
ページ(範囲)95-100
ページ数6
ジャーナルSensors and Actuators, A: Physical
64
1
DOI
出版ステータスPublished - 1998 1 1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering

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