Low-temperature anodic bonding using lithium aluminosilicate-β-quartz glass ceramic

Shuichi Shoji*, Hiroto Kikuchi, Hirotaka Torigoe

*この研究の対応する著者

研究成果: Article査読

54 被引用数 (Scopus)

抄録

Silicon-to-glass anodic bonding is performed at temperatures below 180°C using lithium aluminosilicate-β-quartz glass ceramic. High alkaline ion mobility at low temperature, which is required for bonding, and thermal expansion coefficient matching to Si are realized by controlling the composition of the glass ceramic. Bonding is obtained at a lowest temperature of 140°C. Useful bonding conditions are temperature above 160°C (applied voltage above 500 V). Since the etch rate of the glass ceramic is five times higher than that of Pyrex glass in HF wet etching and the undercut is very small with a Cr-Au etch mask, three-dimensional structures are easily fabricated. Low-temperature anodic bonding using this type of glass ceramic is useful for the packaging and assembling of MEMS.

本文言語English
ページ(範囲)95-100
ページ数6
ジャーナルSensors and Actuators, A: Physical
64
1
DOI
出版ステータスPublished - 1998 1月 1

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 器械工学
  • 凝縮系物理学
  • 表面、皮膜および薄膜
  • 金属および合金
  • 電子工学および電気工学

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