Low temperature Au-Au bonding with VUV/O 3 treatment

Akiko Okada; Masatsugu Nimura; Naoko Unami; Akitsu Shigetou; Hirokazu Noma; Katsuyuki Sakuma; Jun Mizuno; Shuichi Shoji

doi:10.1109/3DIC.2012.6263015

Low temperature Au-Au bonding with VUV/O ₃ treatment

Akiko Okada^*, Masatsugu Nimura, Naoko Unami, Akitsu Shigetou, Hirokazu Noma, Katsuyuki Sakuma, Jun Mizuno, Shuichi Shoji

^*この研究の対応する著者

研究成果: Conference contribution

抄録

This paper describes low temperature Au-Au bonding with vacuum ultraviolet (VUV) irradiation in the presence of oxygen gas. The VUV/O ₃ treatment can remove organic contaminants of Au surfaces without damages. The Au surfaces after the VUV/O ₃ treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The results show that carbon-based contaminants were dramatically decreased and that there were no serious damages in Au surfaces by the VUV/O ₃ treatment. The Au-Au bonding with VUV/O ₃ treatment was achieved at 200 °C. The average of shear strength of about 80 MPa per unit area was obtained. Therefore, it was proved that VUV/O ₃ treatment is effective in Au-Au bonding.

本文言語	English
ホスト出版物のタイトル	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOI	https://doi.org/10.1109/3DIC.2012.6263015
出版ステータス	Published - 2011
イベント	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan 継続期間: 2012 1月 31 → 2012 2月 2

出版物シリーズ

名前	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Conference

Conference	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
国/地域	Japan
City	Osaka
Period	12/1/31 → 12/2/2

ASJC Scopus subject areas

制御およびシステム工学

文献へのアクセス

10.1109/3DIC.2012.6263015

他のファイルとリンク

引用スタイル

Okada, A, Nimura, M, Unami, N, Shigetou, A, Noma, H, Sakuma, K, Mizuno, J & Shoji, S 2011, Low temperature Au-Au bonding with VUV/O ₃ treatment. in 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011., 6263015, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011, Osaka, Japan, 12/1/31. https://doi.org/10.1109/3DIC.2012.6263015

@inproceedings{0c7d59a76a3f4f58b9b03493e57fa694,

title = "Low temperature Au-Au bonding with VUV/O 3 treatment",

abstract = "This paper describes low temperature Au-Au bonding with vacuum ultraviolet (VUV) irradiation in the presence of oxygen gas. The VUV/O 3 treatment can remove organic contaminants of Au surfaces without damages. The Au surfaces after the VUV/O 3 treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The results show that carbon-based contaminants were dramatically decreased and that there were no serious damages in Au surfaces by the VUV/O 3 treatment. The Au-Au bonding with VUV/O 3 treatment was achieved at 200 °C. The average of shear strength of about 80 MPa per unit area was obtained. Therefore, it was proved that VUV/O 3 treatment is effective in Au-Au bonding.",

author = "Akiko Okada and Masatsugu Nimura and Naoko Unami and Akitsu Shigetou and Hirokazu Noma and Katsuyuki Sakuma and Jun Mizuno and Shuichi Shoji",

year = "2011",

doi = "10.1109/3DIC.2012.6263015",

language = "English",

isbn = "9781467321891",

series = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011",

booktitle = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011",

note = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 ; Conference date: 31-01-2012 Through 02-02-2012",

}

TY - GEN

T1 - Low temperature Au-Au bonding with VUV/O 3 treatment

AU - Okada, Akiko

AU - Nimura, Masatsugu

AU - Unami, Naoko

AU - Shigetou, Akitsu

AU - Noma, Hirokazu

AU - Sakuma, Katsuyuki

AU - Mizuno, Jun

AU - Shoji, Shuichi

PY - 2011

Y1 - 2011

N2 - This paper describes low temperature Au-Au bonding with vacuum ultraviolet (VUV) irradiation in the presence of oxygen gas. The VUV/O 3 treatment can remove organic contaminants of Au surfaces without damages. The Au surfaces after the VUV/O 3 treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The results show that carbon-based contaminants were dramatically decreased and that there were no serious damages in Au surfaces by the VUV/O 3 treatment. The Au-Au bonding with VUV/O 3 treatment was achieved at 200 °C. The average of shear strength of about 80 MPa per unit area was obtained. Therefore, it was proved that VUV/O 3 treatment is effective in Au-Au bonding.

AB - This paper describes low temperature Au-Au bonding with vacuum ultraviolet (VUV) irradiation in the presence of oxygen gas. The VUV/O 3 treatment can remove organic contaminants of Au surfaces without damages. The Au surfaces after the VUV/O 3 treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The results show that carbon-based contaminants were dramatically decreased and that there were no serious damages in Au surfaces by the VUV/O 3 treatment. The Au-Au bonding with VUV/O 3 treatment was achieved at 200 °C. The average of shear strength of about 80 MPa per unit area was obtained. Therefore, it was proved that VUV/O 3 treatment is effective in Au-Au bonding.

UR - http://www.scopus.com/inward/record.url?scp=84866877387&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84866877387&partnerID=8YFLogxK

U2 - 10.1109/3DIC.2012.6263015

DO - 10.1109/3DIC.2012.6263015

M3 - Conference contribution

AN - SCOPUS:84866877387

SN - 9781467321891

T3 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

BT - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

T2 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Y2 - 31 January 2012 through 2 February 2012

ER -