Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification

Weixin Fu, Akitsu Shigetou, Shuichi Shoji, Jun Mizuno

研究成果: Conference contribution

抄録

The direct bonding between polyether ether ketone (PEEK) and Pt was feasible at low temperature of 150 oC through vapor assisted VUV treatment. This technology was expected to be applied in future body implantable devices for medical applications. The carboxyl functional groups were created on the PEEK surface during the vapor assisted VUV treatment, as well as the hydrate compound was formed on Pt surface. The highest bonding strength and surface release energy reached 1.15 MPa and 4.6 × 10-1 N/m, respectively, which was considered strong and comparable with conventional PEEK-based direct bonding.

元の言語English
ホスト出版物のタイトルProceedings - ECTC 2016: 66th Electronic Components and Technology Conference
出版者Institute of Electrical and Electronics Engineers Inc.
ページ2541-2546
ページ数6
2016-August
ISBN(電子版)9781509012039
DOI
出版物ステータスPublished - 2016 8 16
外部発表Yes
イベント66th IEEE Electronic Components and Technology Conference, ECTC 2016 - Las Vegas, United States
継続期間: 2016 5 312016 6 3

Other

Other66th IEEE Electronic Components and Technology Conference, ECTC 2016
United States
Las Vegas
期間16/5/3116/6/3

Fingerprint

Polyether ether ketones
Surface treatment
Vapors
Medical applications
Hydrates
Temperature
Functional groups

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

これを引用

Fu, W., Shigetou, A., Shoji, S., & Mizuno, J. (2016). Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification. : Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference (巻 2016-August, pp. 2541-2546). [7545784] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2016.320

Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification. / Fu, Weixin; Shigetou, Akitsu; Shoji, Shuichi; Mizuno, Jun.

Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. 巻 2016-August Institute of Electrical and Electronics Engineers Inc., 2016. p. 2541-2546 7545784.

研究成果: Conference contribution

Fu, W, Shigetou, A, Shoji, S & Mizuno, J 2016, Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification. : Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. 巻. 2016-August, 7545784, Institute of Electrical and Electronics Engineers Inc., pp. 2541-2546, 66th IEEE Electronic Components and Technology Conference, ECTC 2016, Las Vegas, United States, 16/5/31. https://doi.org/10.1109/ECTC.2016.320
Fu W, Shigetou A, Shoji S, Mizuno J. Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification. : Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. 巻 2016-August. Institute of Electrical and Electronics Engineers Inc. 2016. p. 2541-2546. 7545784 https://doi.org/10.1109/ECTC.2016.320
Fu, Weixin ; Shigetou, Akitsu ; Shoji, Shuichi ; Mizuno, Jun. / Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification. Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. 巻 2016-August Institute of Electrical and Electronics Engineers Inc., 2016. pp. 2541-2546
@inproceedings{47400ba95ae94caeafcb45b8f63791f3,
title = "Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification",
abstract = "The direct bonding between polyether ether ketone (PEEK) and Pt was feasible at low temperature of 150 oC through vapor assisted VUV treatment. This technology was expected to be applied in future body implantable devices for medical applications. The carboxyl functional groups were created on the PEEK surface during the vapor assisted VUV treatment, as well as the hydrate compound was formed on Pt surface. The highest bonding strength and surface release energy reached 1.15 MPa and 4.6 × 10-1 N/m, respectively, which was considered strong and comparable with conventional PEEK-based direct bonding.",
keywords = "Hybrid bonding, Low temperature bonding, PEEK, Surface modification, Vapor assisted VUV",
author = "Weixin Fu and Akitsu Shigetou and Shuichi Shoji and Jun Mizuno",
year = "2016",
month = "8",
day = "16",
doi = "10.1109/ECTC.2016.320",
language = "English",
volume = "2016-August",
pages = "2541--2546",
booktitle = "Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",

}

TY - GEN

T1 - Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification

AU - Fu, Weixin

AU - Shigetou, Akitsu

AU - Shoji, Shuichi

AU - Mizuno, Jun

PY - 2016/8/16

Y1 - 2016/8/16

N2 - The direct bonding between polyether ether ketone (PEEK) and Pt was feasible at low temperature of 150 oC through vapor assisted VUV treatment. This technology was expected to be applied in future body implantable devices for medical applications. The carboxyl functional groups were created on the PEEK surface during the vapor assisted VUV treatment, as well as the hydrate compound was formed on Pt surface. The highest bonding strength and surface release energy reached 1.15 MPa and 4.6 × 10-1 N/m, respectively, which was considered strong and comparable with conventional PEEK-based direct bonding.

AB - The direct bonding between polyether ether ketone (PEEK) and Pt was feasible at low temperature of 150 oC through vapor assisted VUV treatment. This technology was expected to be applied in future body implantable devices for medical applications. The carboxyl functional groups were created on the PEEK surface during the vapor assisted VUV treatment, as well as the hydrate compound was formed on Pt surface. The highest bonding strength and surface release energy reached 1.15 MPa and 4.6 × 10-1 N/m, respectively, which was considered strong and comparable with conventional PEEK-based direct bonding.

KW - Hybrid bonding

KW - Low temperature bonding

KW - PEEK

KW - Surface modification

KW - Vapor assisted VUV

UR - http://www.scopus.com/inward/record.url?scp=84987817199&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84987817199&partnerID=8YFLogxK

U2 - 10.1109/ECTC.2016.320

DO - 10.1109/ECTC.2016.320

M3 - Conference contribution

AN - SCOPUS:84987817199

VL - 2016-August

SP - 2541

EP - 2546

BT - Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference

PB - Institute of Electrical and Electronics Engineers Inc.

ER -