TY - GEN
T1 - Low temperature bonding using sub-micron Au particles for wafer-level MEMS packaging
AU - Ito, Shin
AU - Mizuno, Jun
AU - Ishida, Hiroyuki
AU - Ogashiwa, Toshinori
AU - Kanehira, Yukio
AU - Murai, Hiroshi
AU - Wakai, Fumihiro
AU - Shoji, Shuichi
PY - 2012/12/1
Y1 - 2012/12/1
N2 - In this study, low temperature bonding using sub-micron Au particles was investigated. Two types of Au particles with different average mean diameter of 0.1 μm and 0.3 μm were used. The 0.1 μm Au particles were sintered at lower temperature than that of 0.3 μm. These particles have an advantage of low sintering temperature under 200°C, and compensating surface roughness. The compression deformation properties of Au particles were measured. They were compressed to around 3 and 5 μm at 30 and 100 MPa applied pressure, respectively. Chip-level bonding was performed with sealing rings of Au particles. The tensile strength of 55.2 MPa was obtained by bonding under applied pressure of 50 MPa at 100°C. As the evaluation of hermeticity, gross leak test was performed for bonded chips with single, double, and triple sealing rings.
AB - In this study, low temperature bonding using sub-micron Au particles was investigated. Two types of Au particles with different average mean diameter of 0.1 μm and 0.3 μm were used. The 0.1 μm Au particles were sintered at lower temperature than that of 0.3 μm. These particles have an advantage of low sintering temperature under 200°C, and compensating surface roughness. The compression deformation properties of Au particles were measured. They were compressed to around 3 and 5 μm at 30 and 100 MPa applied pressure, respectively. Chip-level bonding was performed with sealing rings of Au particles. The tensile strength of 55.2 MPa was obtained by bonding under applied pressure of 50 MPa at 100°C. As the evaluation of hermeticity, gross leak test was performed for bonded chips with single, double, and triple sealing rings.
UR - http://www.scopus.com/inward/record.url?scp=84879747661&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84879747661&partnerID=8YFLogxK
U2 - 10.1109/ICSJ.2012.6523451
DO - 10.1109/ICSJ.2012.6523451
M3 - Conference contribution
AN - SCOPUS:84879747661
SN - 9781467326551
T3 - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
BT - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
T2 - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
Y2 - 10 December 2012 through 12 December 2012
ER -