Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

Kosuke Yamada*, Hiroyuki Kuwae, Takumi Kamibayashi, Wataru Momose, Shuichi Shoji, Jun Mizuno

*この研究の対応する著者

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

We propose a low temperature bonding technique using an ultrathin intermediate layer deposited by atomic layer deposition. The ultrathin Pt film is selectively deposited on Cu surfaces without any masks. In order to reduce a deterioration of a reliability caused by impurities in the bonding interface, quasi-direct bonding was realized by thinning Pt intermediate layer. The shear strength of Cu-Cu bonding with the Pt intermediate layer achieved 9.5 MPa, which was five times higher than that without the Pt intermediate layer. We expect that the proposed bonding technique has a high potential to low temperature packaging technologies.

本文言語English
ホスト出版物のタイトル13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
出版社IEEE Computer Society
ページ123-126
ページ数4
ISBN(電子版)9781538656150
DOI
出版ステータスPublished - 2019 1 24
イベント13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 - Taipei, Taiwan, Province of China
継続期間: 2018 10 242018 10 26

出版物シリーズ

名前Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
2018-October
ISSN(印刷版)2150-5934
ISSN(電子版)2150-5942

Conference

Conference13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
国/地域Taiwan, Province of China
CityTaipei
Period18/10/2418/10/26

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 制御およびシステム工学
  • 電子工学および電気工学

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