Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

Kosuke Yamada, Hiroyuki Kuwae, Takumi Kamibayashi, Wataru Momose, Shuichi Shoji, Jun Mizuno

研究成果: Conference contribution

1 引用 (Scopus)

抄録

We propose a low temperature bonding technique using an ultrathin intermediate layer deposited by atomic layer deposition. The ultrathin Pt film is selectively deposited on Cu surfaces without any masks. In order to reduce a deterioration of a reliability caused by impurities in the bonding interface, quasi-direct bonding was realized by thinning Pt intermediate layer. The shear strength of Cu-Cu bonding with the Pt intermediate layer achieved 9.5 MPa, which was five times higher than that without the Pt intermediate layer. We expect that the proposed bonding technique has a high potential to low temperature packaging technologies.

元の言語English
ホスト出版物のタイトル13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
出版者IEEE Computer Society
ページ123-126
ページ数4
ISBN(電子版)9781538656150
DOI
出版物ステータスPublished - 2019 1 24
イベント13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 - Taipei, Taiwan, Province of China
継続期間: 2018 10 242018 10 26

出版物シリーズ

名前Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
2018-October
ISSN(印刷物)2150-5934
ISSN(電子版)2150-5942

Conference

Conference13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
Taiwan, Province of China
Taipei
期間18/10/2418/10/26

Fingerprint

Atomic layer deposition
Platinum
Copper
Temperature
Ultrathin films
Shear strength
Deterioration
Masks
Packaging
Impurities

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

これを引用

Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S., & Mizuno, J. (2019). Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition. : 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 (pp. 123-126). [8625756] (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 巻数 2018-October). IEEE Computer Society. https://doi.org/10.1109/IMPACT.2018.8625756

Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition. / Yamada, Kosuke; Kuwae, Hiroyuki; Kamibayashi, Takumi; Momose, Wataru; Shoji, Shuichi; Mizuno, Jun.

13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, 2019. p. 123-126 8625756 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 巻 2018-October).

研究成果: Conference contribution

Yamada, K, Kuwae, H, Kamibayashi, T, Momose, W, Shoji, S & Mizuno, J 2019, Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition. : 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018., 8625756, Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 巻. 2018-October, IEEE Computer Society, pp. 123-126, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018, Taipei, Taiwan, Province of China, 18/10/24. https://doi.org/10.1109/IMPACT.2018.8625756
Yamada K, Kuwae H, Kamibayashi T, Momose W, Shoji S, Mizuno J. Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition. : 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society. 2019. p. 123-126. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). https://doi.org/10.1109/IMPACT.2018.8625756
Yamada, Kosuke ; Kuwae, Hiroyuki ; Kamibayashi, Takumi ; Momose, Wataru ; Shoji, Shuichi ; Mizuno, Jun. / Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition. 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, 2019. pp. 123-126 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).
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