Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments

Weixin Fu, Akitsu Shigetou, Shuichi Shoji, Jun Mizuno

研究成果: Conference contribution

抄録

A direct hybrid bonding of PEEK-Pt is feasible at low temperature of 150 °C through surface treatment technologies of vacuum ultraviolet (VUV) and fast atom bombardment (FAB). The X-ray photoelectron spectroscopy showed the VUV treatment was capable of creating hydrate bridge layers on both PEEK and Pt surfaces, which were considered to form a robust bond through dehydration reactions. Shear strength test showed that the VUV-treated samples were stronger than the FAB-treated ones, and the highest strength reached 0.91 MPa, which was comparable with conventional PEEK-based direct bondings. This technology is expected to be applied in future body implantable medical micro electromechanical system devices.

本文言語English
ホスト出版物のタイトル2016 International Conference on Electronics Packaging, ICEP 2016
出版社Institute of Electrical and Electronics Engineers Inc.
ページ302-305
ページ数4
ISBN(電子版)9784904090176
DOI
出版ステータスPublished - 2016 6 7
イベント2016 International Conference on Electronics Packaging, ICEP 2016 - Hokkaido, Japan
継続期間: 2016 4 202016 4 22

出版物シリーズ

名前2016 International Conference on Electronics Packaging, ICEP 2016

Other

Other2016 International Conference on Electronics Packaging, ICEP 2016
国/地域Japan
CityHokkaido
Period16/4/2016/4/22

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学
  • 材料力学

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