Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments

Weixin Fu, Akitsu Shigetou, Shuichi Shoji, Jun Mizuno

研究成果: Conference contribution

抄録

A direct hybrid bonding of PEEK-Pt is feasible at low temperature of 150 °C through surface treatment technologies of vacuum ultraviolet (VUV) and fast atom bombardment (FAB). The X-ray photoelectron spectroscopy showed the VUV treatment was capable of creating hydrate bridge layers on both PEEK and Pt surfaces, which were considered to form a robust bond through dehydration reactions. Shear strength test showed that the VUV-treated samples were stronger than the FAB-treated ones, and the highest strength reached 0.91 MPa, which was comparable with conventional PEEK-based direct bondings. This technology is expected to be applied in future body implantable medical micro electromechanical system devices.

元の言語English
ホスト出版物のタイトル2016 International Conference on Electronics Packaging, ICEP 2016
出版者Institute of Electrical and Electronics Engineers Inc.
ページ302-305
ページ数4
ISBN(電子版)9784904090176
DOI
出版物ステータスPublished - 2016 6 7
イベント2016 International Conference on Electronics Packaging, ICEP 2016 - Hokkaido, Japan
継続期間: 2016 4 202016 4 22

Other

Other2016 International Conference on Electronics Packaging, ICEP 2016
Japan
Hokkaido
期間16/4/2016/4/22

Fingerprint

Polyether ether ketones
Surface treatment
Vacuum
Atoms
Hydrates
Dehydration
Shear strength
Temperature
MEMS
X ray photoelectron spectroscopy
polyetheretherketone

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Mechanics of Materials

これを引用

Fu, W., Shigetou, A., Shoji, S., & Mizuno, J. (2016). Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments. : 2016 International Conference on Electronics Packaging, ICEP 2016 (pp. 302-305). [7486834] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEP.2016.7486834

Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments. / Fu, Weixin; Shigetou, Akitsu; Shoji, Shuichi; Mizuno, Jun.

2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 302-305 7486834.

研究成果: Conference contribution

Fu, W, Shigetou, A, Shoji, S & Mizuno, J 2016, Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments. : 2016 International Conference on Electronics Packaging, ICEP 2016., 7486834, Institute of Electrical and Electronics Engineers Inc., pp. 302-305, 2016 International Conference on Electronics Packaging, ICEP 2016, Hokkaido, Japan, 16/4/20. https://doi.org/10.1109/ICEP.2016.7486834
Fu W, Shigetou A, Shoji S, Mizuno J. Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments. : 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 302-305. 7486834 https://doi.org/10.1109/ICEP.2016.7486834
Fu, Weixin ; Shigetou, Akitsu ; Shoji, Shuichi ; Mizuno, Jun. / Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments. 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 302-305
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