抄録
The direct bonding between polyether ether ketone (PEEK) and Pt was feasible at 150 °C via the surface modification using vacuum ultraviolet (VUV). This technology will be of practical use in the eco-friendly fabrication of light-weight and bio-inert electronic system, such as a body-implantation medical device. The VUV irradiation helped creating the bridging layers, which consisted of hydroxyl groups due to the residual water molecules inside the bonding chamber, both on PEEK and Pt surfaces. Upon heating at 150 °C, the Pt ions diffused into PEEK side as the micro-grains at the PEEK-Pt interface, and a voidless interface was successfully obtained with the calculated bonding strain release energy of around 4.2 N/m. This energy is higher than the surface energy of both PEEK and Pt.
本文言語 | English |
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ホスト出版物のタイトル | 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings |
出版社 | Institute of Electrical and Electronics Engineers Inc. |
ページ | 217-220 |
ページ数 | 4 |
ISBN(印刷版) | 9781467383561 |
DOI | |
出版ステータス | Published - 2015 12月 23 |
イベント | 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei, Taiwan, Province of China 継続期間: 2015 10月 21 → 2015 10月 23 |
Other
Other | 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 |
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国/地域 | Taiwan, Province of China |
City | Taipei |
Period | 15/10/21 → 15/10/23 |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 電子工学および電気工学