Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

Weixin Fu, Hiroyuki Kuwae, Bo Ma, Shuichi Shoji, Jun Mizuno

研究成果: Conference contribution

抄録

Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O3) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.

本文言語English
ホスト出版物のタイトル2017 International Conference on Electronics Packaging, ICEP 2017
出版社Institute of Electrical and Electronics Engineers Inc.
ページ167-170
ページ数4
ISBN(電子版)9784990218836
DOI
出版ステータスPublished - 2017 6 5
イベント2017 International Conference on Electronics Packaging, ICEP 2017 - Tendo, Yamagata, Japan
継続期間: 2017 4 192017 4 22

Other

Other2017 International Conference on Electronics Packaging, ICEP 2017
国/地域Japan
CityTendo, Yamagata
Period17/4/1917/4/22

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 産業および生産工学
  • 電子材料、光学材料、および磁性材料

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