Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

研究成果: Conference contribution

抄録

Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O3) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.

元の言語English
ホスト出版物のタイトル2017 International Conference on Electronics Packaging, ICEP 2017
出版者Institute of Electrical and Electronics Engineers Inc.
ページ167-170
ページ数4
ISBN(電子版)9784990218836
DOI
出版物ステータスPublished - 2017 6 5
イベント2017 International Conference on Electronics Packaging, ICEP 2017 - Tendo, Yamagata, Japan
継続期間: 2017 4 192017 4 22

Other

Other2017 International Conference on Electronics Packaging, ICEP 2017
Japan
Tendo, Yamagata
期間17/4/1917/4/22

Fingerprint

Self assembly
Monolayers
Electron devices
Temperature
Debonding
Fourier transform infrared spectroscopy
Gases
Chemical activation
Irradiation
Vacuum
Oxygen
delrin
Substrates
amino-propyl-triethoxysilane
trimethoxysilane

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

これを引用

Fu, W., Kuwae, H., Ma, B., Shoji, S., & Mizuno, J. (2017). Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM). : 2017 International Conference on Electronics Packaging, ICEP 2017 (pp. 167-170). [7939349] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2017.7939349

Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM). / Fu, Weixin; Kuwae, Hiroyuki; Ma, Bo; Shoji, Shuichi; Mizuno, Jun.

2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 167-170 7939349.

研究成果: Conference contribution

Fu, W, Kuwae, H, Ma, B, Shoji, S & Mizuno, J 2017, Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM). : 2017 International Conference on Electronics Packaging, ICEP 2017., 7939349, Institute of Electrical and Electronics Engineers Inc., pp. 167-170, 2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Yamagata, Japan, 17/4/19. https://doi.org/10.23919/ICEP.2017.7939349
Fu W, Kuwae H, Ma B, Shoji S, Mizuno J. Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM). : 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 167-170. 7939349 https://doi.org/10.23919/ICEP.2017.7939349
Fu, Weixin ; Kuwae, Hiroyuki ; Ma, Bo ; Shoji, Shuichi ; Mizuno, Jun. / Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM). 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 167-170
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