TY - JOUR
T1 - Low temperature direct crystallization of SrBi2(Ta1-xNbx)2O9 thin films by thermal metalorganic chemical vapor deposition and their properties
AU - Mitsuya, Masatoshi
AU - Nukaga, Norimasa
AU - Saito, Keisuke
AU - Osada, Minoru
AU - Funakubo, Hiroshi
PY - 2001/5
Y1 - 2001/5
N2 - Directly crystallized SrBi2(Ta1-xNbx)2O9 (SBTN) films were deposited on (111) Pt/Ti/SiO2/Si substrates at 585-670°C by thermal metalorganic chemical vapor deposition (MOCVD). The crystalline SBTN film was directly deposited at 670°C irrespective of the deposition rate, but its leakage current markedly decreased when the deposition rate decreased from 5.0 to 2.1 nm/min. When the deposition rate was below 2.1 nm/min, an SBTN film with large ferroelectricity was deposited even at 585°C, and strong (103)-orientation was ascertained by an X-ray reciprocal space mapping method. This orientation is considered to locally epitaxially occur on a (111)-oriented Pt substrate. Twice the remanent polarization (2Pr) and twice the coercive field (2Ec) of the film deposited at 585°C were 12.2 μC/cm2 and 160 kV/cm, respectively. When the deposition temperature increased, the film became randomly oriented which was in response to the orientation change in the Pt substrate from single (111) to a mixed orientation of (111) and (100) orientations by heating before starting the film deposition. 2Pr and 2Ec of the film deposited at 670°C increased to 23.8 μC/cm2 and 190 kV/cm, respectively.
AB - Directly crystallized SrBi2(Ta1-xNbx)2O9 (SBTN) films were deposited on (111) Pt/Ti/SiO2/Si substrates at 585-670°C by thermal metalorganic chemical vapor deposition (MOCVD). The crystalline SBTN film was directly deposited at 670°C irrespective of the deposition rate, but its leakage current markedly decreased when the deposition rate decreased from 5.0 to 2.1 nm/min. When the deposition rate was below 2.1 nm/min, an SBTN film with large ferroelectricity was deposited even at 585°C, and strong (103)-orientation was ascertained by an X-ray reciprocal space mapping method. This orientation is considered to locally epitaxially occur on a (111)-oriented Pt substrate. Twice the remanent polarization (2Pr) and twice the coercive field (2Ec) of the film deposited at 585°C were 12.2 μC/cm2 and 160 kV/cm, respectively. When the deposition temperature increased, the film became randomly oriented which was in response to the orientation change in the Pt substrate from single (111) to a mixed orientation of (111) and (100) orientations by heating before starting the film deposition. 2Pr and 2Ec of the film deposited at 670°C increased to 23.8 μC/cm2 and 190 kV/cm, respectively.
KW - Direct preparation
KW - Fatigue free
KW - Low deposition temperature
KW - Metalorganic chemical vapor deposition
KW - Strontium bismuth tantalum niobium oxide
UR - http://www.scopus.com/inward/record.url?scp=0035328562&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0035328562&partnerID=8YFLogxK
M3 - Article
AN - SCOPUS:0035328562
VL - 40
SP - 3337
EP - 3342
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
SN - 0021-4922
IS - 5 A
ER -