Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects

Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Shuichi Shoji, Hiroshi Nishikawa

研究成果: Conference contribution

6 被引用数 (Scopus)

抄録

We proposed low-temperature Au-Au bump interconnects bonding using nanoporous Au-Ag powders as a connective adhesion. The nanoporous powders were formed by de-alloying Au-Ag alloy in HNO3 solution. To optimize the pore size, the influence of the annealing temperature on the porous structures was investigated. Selective transfer of the nanoporous powders on bumps was obtained by stamping process. Bonding strength of about 2.4 MPa was achieved at 150°C by using nanoporous Au-Ag powders. Bonding interface was evaluated by scanning acoustic microscope and scanning electron microscopy. This result indicated that the nanoporous powder is a useful material for low-temperature Au-Au bonding.

本文言語English
ホスト出版物のタイトルMEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
出版社Institute of Electrical and Electronics Engineers Inc.
ページ1131-1134
ページ数4
ISBN(印刷版)9781479935086
DOI
出版ステータスPublished - 2014
イベント27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 - San Francisco, CA, United States
継続期間: 2014 1 262014 1 30

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷版)1084-6999

Conference

Conference27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
国/地域United States
CitySan Francisco, CA
Period14/1/2614/1/30

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 機械工学
  • 電子工学および電気工学

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