Low-Temperature Growth of Carbon Nanotube Forests Consisting of Tubes with Narrow Inner Spacing Using Co/Al/Mo Catalyst on Conductive Supports

Hisashi Sugime, Santiago Esconjauregui, Lorenzo D'Arsié, Junwei Yang, Alex W. Robertson, Rachel A. Oliver, Sunil Bhardwaj, Cinzia Cepek, John Robertson

研究成果: Article

19 引用 (Scopus)

抄録

We grow dense carbon nanotube forests at 450 °C on Cu support using Co/Al/Mo multilayer catalyst. As a partial barrier layer for the diffusion of Co into Mo, we apply very thin Al layer with the nominal thickness of 0.50 nm between Co and Mo. This Al layer plays an important role in the growth of dense CNT forests, partially preventing the Co-Mo interaction. The forests have an average height of ∼300 nm and a mass density of 1.2 g cm-3 with tubes exhibiting extremely narrow inner spacing. An ohmic behavior is confirmed between the forest and Cu support with the lowest resistance of ∼8 kΩ. The forest shows a high thermal effusivity of 1840 J s-0.5 m-2 K-1, and a thermal conductivity of 4.0 J s-1 m-1 K-1, suggesting that these forests are useful for heat dissipation devices. (Figure Presented).

元の言語English
ページ(範囲)16819-16827
ページ数9
ジャーナルACS Applied Materials and Interfaces
7
発行部数30
DOI
出版物ステータスPublished - 2015 8 5
外部発表Yes

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Carbon Nanotubes
Growth temperature
Heat losses
Catalyst supports
Carbon nanotubes
Thermal conductivity
Multilayers
Catalysts
Hot Temperature

ASJC Scopus subject areas

  • Materials Science(all)

これを引用

Low-Temperature Growth of Carbon Nanotube Forests Consisting of Tubes with Narrow Inner Spacing Using Co/Al/Mo Catalyst on Conductive Supports. / Sugime, Hisashi; Esconjauregui, Santiago; D'Arsié, Lorenzo; Yang, Junwei; Robertson, Alex W.; Oliver, Rachel A.; Bhardwaj, Sunil; Cepek, Cinzia; Robertson, John.

:: ACS Applied Materials and Interfaces, 巻 7, 番号 30, 05.08.2015, p. 16819-16827.

研究成果: Article

Sugime, H, Esconjauregui, S, D'Arsié, L, Yang, J, Robertson, AW, Oliver, RA, Bhardwaj, S, Cepek, C & Robertson, J 2015, 'Low-Temperature Growth of Carbon Nanotube Forests Consisting of Tubes with Narrow Inner Spacing Using Co/Al/Mo Catalyst on Conductive Supports', ACS Applied Materials and Interfaces, 巻. 7, 番号 30, pp. 16819-16827. https://doi.org/10.1021/acsami.5b04846
Sugime, Hisashi ; Esconjauregui, Santiago ; D'Arsié, Lorenzo ; Yang, Junwei ; Robertson, Alex W. ; Oliver, Rachel A. ; Bhardwaj, Sunil ; Cepek, Cinzia ; Robertson, John. / Low-Temperature Growth of Carbon Nanotube Forests Consisting of Tubes with Narrow Inner Spacing Using Co/Al/Mo Catalyst on Conductive Supports. :: ACS Applied Materials and Interfaces. 2015 ; 巻 7, 番号 30. pp. 16819-16827.
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abstract = "We grow dense carbon nanotube forests at 450 °C on Cu support using Co/Al/Mo multilayer catalyst. As a partial barrier layer for the diffusion of Co into Mo, we apply very thin Al layer with the nominal thickness of 0.50 nm between Co and Mo. This Al layer plays an important role in the growth of dense CNT forests, partially preventing the Co-Mo interaction. The forests have an average height of ∼300 nm and a mass density of 1.2 g cm-3 with tubes exhibiting extremely narrow inner spacing. An ohmic behavior is confirmed between the forest and Cu support with the lowest resistance of ∼8 kΩ. The forest shows a high thermal effusivity of 1840 J s-0.5 m-2 K-1, and a thermal conductivity of 4.0 J s-1 m-1 K-1, suggesting that these forests are useful for heat dissipation devices. (Figure Presented).",
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AU - D'Arsié, Lorenzo

AU - Yang, Junwei

AU - Robertson, Alex W.

AU - Oliver, Rachel A.

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AB - We grow dense carbon nanotube forests at 450 °C on Cu support using Co/Al/Mo multilayer catalyst. As a partial barrier layer for the diffusion of Co into Mo, we apply very thin Al layer with the nominal thickness of 0.50 nm between Co and Mo. This Al layer plays an important role in the growth of dense CNT forests, partially preventing the Co-Mo interaction. The forests have an average height of ∼300 nm and a mass density of 1.2 g cm-3 with tubes exhibiting extremely narrow inner spacing. An ohmic behavior is confirmed between the forest and Cu support with the lowest resistance of ∼8 kΩ. The forest shows a high thermal effusivity of 1840 J s-0.5 m-2 K-1, and a thermal conductivity of 4.0 J s-1 m-1 K-1, suggesting that these forests are useful for heat dissipation devices. (Figure Presented).

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KW - cocatalyst

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KW - sputtering

KW - thermal conductivity

KW - thermal effusivity

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