Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering

Takehiro Yamamoto, M. Khairi Faiz, Tadatomo Suga, Tomoyuki Miyashita, Makoto Yoshida

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

In this work, low temperature of 200°C, low pressure of 0.1MPa, fluxless and plateless Cu-Cu bonding in SiC power module is achieved by the transient phase liquid sintering (TLPS) of Cu nano particle and Sn-Bi eutectic powder. In this paper, shear strength at room temperature and 150°C of two compositions of Cu mixed with Sn-Bi is investigated and the factor influencing the shear strength at 150°C is examined by means of differential scanning calorimetry (DSC). In 70 mass% added Sn-Bi (Cu-70SnBi), which was sintered at 200°C, the remelting event at 139°C occurred due to the residual Sn-Bi eutectic phase and assumed to result in the decrease of shear strength at 150°C. On contrary, in 65 mass% added Sn-Bi (Cu-65SnBi), which was sintered at the same conditions, remelting event at 139°C was not observed, and the obtained shear strength at 150°C was almost similar to that of at room temperature (R. T.).

本文言語English
ホスト出版物のタイトル2017 IEEE CPMT Symposium Japan, ICSJ 2017
出版社Institute of Electrical and Electronics Engineers Inc.
ページ139-140
ページ数2
ISBN(電子版)9781538627129
DOI
出版ステータスPublished - 2017 12 26
イベント2017 IEEE CPMT Symposium Japan, ICSJ 2017 - Kyoto, Japan
継続期間: 2017 11 202017 11 22

出版物シリーズ

名前2017 IEEE CPMT Symposium Japan, ICSJ 2017
2017-January

Other

Other2017 IEEE CPMT Symposium Japan, ICSJ 2017
国/地域Japan
CityKyoto
Period17/11/2017/11/22

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料

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