Low-temperature poly(oxymethylene) direct bonding via self-assembled monolayer

Weixin Fu, Bo Ma, Hiroyuki Kuwae, Shuichi Shoji, Jun Mizuno

研究成果: Article査読

4 被引用数 (Scopus)

抄録

A direct bonding of poly(oxymethylene) (POM) was feasible at 100 °C by using self-assembled monolayer (SAM) as a surface modification method. (3-aminopropyl)triethoxysilane (APTES) and (3-glycidyloxypropyl)trimethoxysilane (GOPTS) were used in our work. X-ray photoelectron spectroscopy showed that both APTES and GOPTS modified the POM surface successfully. Bonding strength evaluation revealed that surface modification was affected by pretreatment (VUV/O3) process time. In addition, the bonding condition with highest strength had an average strength of 372 kPa. This technology is expected to be used in packaging for micro-/nano-electromechanical systems, such as biomedical devices.

本文言語English
論文番号02BB01
ジャーナルJapanese Journal of Applied Physics
57
2
DOI
出版ステータスPublished - 2018 2 1

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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