Low-temperature poly(oxymethylene) direct bonding via self-assembled monolayer

Weixin Fu; Bo Ma; Hiroyuki Kuwae; Shuichi Shoji; Jun Mizuno

doi:10.7567/JJAP.57.02BB01

Low-temperature poly(oxymethylene) direct bonding via self-assembled monolayer

Weixin Fu, Bo Ma, Hiroyuki Kuwae, Shuichi Shoji, Jun Mizuno

ナノ・ライフ創新研究機構

研究成果: Article › 査読

4 被引用数 (Scopus)

抄録

A direct bonding of poly(oxymethylene) (POM) was feasible at 100 °C by using self-assembled monolayer (SAM) as a surface modification method. (3-aminopropyl)triethoxysilane (APTES) and (3-glycidyloxypropyl)trimethoxysilane (GOPTS) were used in our work. X-ray photoelectron spectroscopy showed that both APTES and GOPTS modified the POM surface successfully. Bonding strength evaluation revealed that surface modification was affected by pretreatment (VUV/O₃) process time. In addition, the bonding condition with highest strength had an average strength of 372 kPa. This technology is expected to be used in packaging for micro-/nano-electromechanical systems, such as biomedical devices.

本文言語	English
論文番号	02BB01
ジャーナル	Japanese Journal of Applied Physics
巻	57
号	2
DOI	https://doi.org/10.7567/JJAP.57.02BB01
出版ステータス	Published - 2018 2 1

ASJC Scopus subject areas

Engineering(all)
Physics and Astronomy(all)

文献へのアクセス

10.7567/JJAP.57.02BB01

フィンガープリント「Low-temperature poly(oxymethylene) direct bonding via self-assembled monolayer」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル

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abstract = "A direct bonding of poly(oxymethylene) (POM) was feasible at 100 °C by using self-assembled monolayer (SAM) as a surface modification method. (3-aminopropyl)triethoxysilane (APTES) and (3-glycidyloxypropyl)trimethoxysilane (GOPTS) were used in our work. X-ray photoelectron spectroscopy showed that both APTES and GOPTS modified the POM surface successfully. Bonding strength evaluation revealed that surface modification was affected by pretreatment (VUV/O3) process time. In addition, the bonding condition with highest strength had an average strength of 372 kPa. This technology is expected to be used in packaging for micro-/nano-electromechanical systems, such as biomedical devices.",

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AU - Mizuno, Jun

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