抄録
In this study, a new wafer bonding method for MEMS (micro electro mechanical systems) packaging is presented. The seal lines of sub-micron size Au particles with a width of 50 μm were formed on wafers by means of screen-printing. The bonding process was carried out at 300°C under reduced pressure, 1 × 10-3 mbar. The bonded wafers were diced into 5 mm × 5 mm individual chips. The bond strength of each chips was about 20 MPa measured by a tensile test and about 40 MPa by a shear test in the average. It was confirmed that two wafers were successfully bonded with screen-printed Au particle seal lines. The proposed method can be applied to practical MEMS packaging.
| 本文言語 | English |
|---|---|
| ページ（範囲） | 2275-2277 |
| ページ数 | 3 |
| ジャーナル | Microelectronic Engineering |
| 巻 | 88 |
| 号 | 8 |
| DOI | |
| 出版ステータス | Published - 2011 8月 |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 原子分子物理学および光学
- 凝縮系物理学
- 表面、皮膜および薄膜
- 電子工学および電気工学