In this study, a new wafer bonding method for MEMS (micro electro mechanical systems) packaging is presented. The seal lines of sub-micron size Au particles with a width of 50 μm were formed on wafers by means of screen-printing. The bonding process was carried out at 300°C under reduced pressure, 1 × 10-3 mbar. The bonded wafers were diced into 5 mm × 5 mm individual chips. The bond strength of each chips was about 20 MPa measured by a tensile test and about 40 MPa by a shear test in the average. It was confirmed that two wafers were successfully bonded with screen-printed Au particle seal lines. The proposed method can be applied to practical MEMS packaging.
|出版ステータス||Published - 2011 8月|
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