TY - GEN
T1 - Low-temperature wafer bonding using sub-micron gold particles for wafer-level MEMS packaging
AU - Ishida, H.
AU - Ogashiwa, T.
AU - Kanehira, Y.
AU - Ito, S.
AU - Yazaki, T.
AU - Mizuno, J.
PY - 2012/8/15
Y1 - 2012/8/15
N2 - Low-temperature wafer bonding using sub-m gold particles together with wafer-level pattern transfer method has been developed. Sub-m Au particle patterns were successfully transferred at 150°C and wafer bonding was performed at 200°C. Surface compliant performance was demonstrated by compression deformation measurement.
AB - Low-temperature wafer bonding using sub-m gold particles together with wafer-level pattern transfer method has been developed. Sub-m Au particle patterns were successfully transferred at 150°C and wafer bonding was performed at 200°C. Surface compliant performance was demonstrated by compression deformation measurement.
UR - http://www.scopus.com/inward/record.url?scp=84864853466&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84864853466&partnerID=8YFLogxK
U2 - 10.1109/LTB-3D.2012.6238083
DO - 10.1109/LTB-3D.2012.6238083
M3 - Conference contribution
AN - SCOPUS:84864853466
SN - 9781467307420
T3 - Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
BT - Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
T2 - 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Y2 - 22 May 2012 through 23 May 2012
ER -