Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding

T. Yokoshima, Y. Yamaji, N. Igawa, K. Kikuchi, H. Nakagawa, M. Aoyagi

研究成果: Conference contribution

2 引用 (Scopus)

抜粋

Deposition behavior of localized electroless NiB deposition for pad-to-pad connection was investigated. Localized deposition occurred mainly on the area between facing pads, and anisotropic deposition toward each facing pad was obtained. Thus, this connection, "preferential bridge connection", is no need of photolithographic technique. These results indicated that this process is one of the maskless fabrication processes. Moreover, chemical flip-chip bonding containing preferential bridge interconnection was demonstrated. The chip-to-substrate interconnection with 30 μm pitch was successfully achieved.

元の言語English
ホスト出版物のタイトルECS Transactions - Electronics Packaging 3 - 214th ECS Meeting
ページ77-85
ページ数9
エディション22
DOI
出版物ステータスPublished - 2009 11 23
外部発表Yes
イベントElectronics Packaging 3 - 214th ECS Meeting - Honolulu, HI, United States
継続期間: 2008 10 122008 10 17

出版物シリーズ

名前ECS Transactions
番号22
16
ISSN(印刷物)1938-5862
ISSN(電子版)1938-6737

Conference

ConferenceElectronics Packaging 3 - 214th ECS Meeting
United States
Honolulu, HI
期間08/10/1208/10/17

ASJC Scopus subject areas

  • Engineering(all)

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  • これを引用

    Yokoshima, T., Yamaji, Y., Igawa, N., Kikuchi, K., Nakagawa, H., & Aoyagi, M. (2009). Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding. : ECS Transactions - Electronics Packaging 3 - 214th ECS Meeting (22 版, pp. 77-85). (ECS Transactions; 巻数 16, 番号 22). https://doi.org/10.1149/1.3115653