For predicting solidification cracking by thermal stress analysis, the mechanical properties in the partially solidified state based on the experimental results are the best hope. However, the Young’s modulus has never been investigated for copper alloys. In this study, stress–strain curves of a Cu-Zn alloy in the partially solidified state for various solid fractions were obtained using a specially developed horizontal tensile test device. Furthermore, by removing the load during the tensile test, the spring-back (elastic behavior) was observed and the Young’s modulus was obtained.
|ジャーナル||Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science|
|出版ステータス||Accepted/In press - 2016 2 3|
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