Mechanical Properties of a Partially Solidified Cu-Zn Alloy

Naoki Kasuya, Tomoaki Nakazawa, Akira Matsushita*, Toshimitsu Okane, Makoto Yoshida


    研究成果: Article査読

    5 被引用数 (Scopus)


    For predicting solidification cracking by thermal stress analysis, the mechanical properties in the partially solidified state based on the experimental results are the best hope. However, the Young’s modulus has never been investigated for copper alloys. In this study, stress–strain curves of a Cu-Zn alloy in the partially solidified state for various solid fractions were obtained using a specially developed horizontal tensile test device. Furthermore, by removing the load during the tensile test, the spring-back (elastic behavior) was observed and the Young’s modulus was obtained.

    ジャーナルMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
    出版ステータスAccepted/In press - 2016 2月 3

    ASJC Scopus subject areas

    • 凝縮系物理学
    • 金属および合金
    • 材料力学


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