Mechanical Properties of a Partially Solidified Cu-Zn Alloy

Naoki Kasuya, Tomoaki Nakazawa, Akira Matsushita*, Toshimitsu Okane, Makoto Yoshida

*この研究の対応する著者

    研究成果: Article査読

    5 被引用数 (Scopus)

    抄録

    For predicting solidification cracking by thermal stress analysis, the mechanical properties in the partially solidified state based on the experimental results are the best hope. However, the Young’s modulus has never been investigated for copper alloys. In this study, stress–strain curves of a Cu-Zn alloy in the partially solidified state for various solid fractions were obtained using a specially developed horizontal tensile test device. Furthermore, by removing the load during the tensile test, the spring-back (elastic behavior) was observed and the Young’s modulus was obtained.

    本文言語English
    ページ(範囲)1-7
    ページ数7
    ジャーナルMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
    DOI
    出版ステータスAccepted/In press - 2016 2 3

    ASJC Scopus subject areas

    • 凝縮系物理学
    • 金属および合金
    • 材料力学

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