TY - JOUR
T1 - Mechanical Properties of a Partially Solidified Cu-Zn Alloy
AU - Kasuya, Naoki
AU - Nakazawa, Tomoaki
AU - Matsushita, Akira
AU - Okane, Toshimitsu
AU - Yoshida, Makoto
PY - 2016/2/3
Y1 - 2016/2/3
N2 - For predicting solidification cracking by thermal stress analysis, the mechanical properties in the partially solidified state based on the experimental results are the best hope. However, the Young’s modulus has never been investigated for copper alloys. In this study, stress–strain curves of a Cu-Zn alloy in the partially solidified state for various solid fractions were obtained using a specially developed horizontal tensile test device. Furthermore, by removing the load during the tensile test, the spring-back (elastic behavior) was observed and the Young’s modulus was obtained.
AB - For predicting solidification cracking by thermal stress analysis, the mechanical properties in the partially solidified state based on the experimental results are the best hope. However, the Young’s modulus has never been investigated for copper alloys. In this study, stress–strain curves of a Cu-Zn alloy in the partially solidified state for various solid fractions were obtained using a specially developed horizontal tensile test device. Furthermore, by removing the load during the tensile test, the spring-back (elastic behavior) was observed and the Young’s modulus was obtained.
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U2 - 10.1007/s11661-016-3353-6
DO - 10.1007/s11661-016-3353-6
M3 - Article
AN - SCOPUS:84961286742
SN - 1073-5623
SP - 1
EP - 7
JO - Metallurgical Transactions A
JF - Metallurgical Transactions A
ER -