Mechanism of low temperature sintering-bonding through in-situ formation of silver nanoparticles using silver oxide microparticles

Fengwen Mu, Zhenyu Zhao, Guisheng Zou, Hailin Bai, Aiping Wu, Lei Liu, Dongyue Zhang, Y. Norman Zhou

研究成果: Article査読

10 被引用数 (Scopus)

抄録

In this paper, a low temperature sintering-bonding process through in-situ formation of silver (Ag) nanoparticles using silveroxide (Ag2O) microparticles was studied. The Ag2O powders were mixed with triethylene glycol (TEG) to form a paste, which was used to bond the Ag-coated copper (Cu) bulks. The results revealed that high temperature was helpful to increase the bond strength, and the joints average shear strength can reach 21.9MPa at 523K under 2 MPa for 5 min. And the mechanism of the reaction and sintering bonding process were basically made clear by using TGA-FTIR, FE-SEM and XRD, further, a reasonable sintering-bonding model was proposed.

本文言語English
ページ(範囲)872-878
ページ数7
ジャーナルMaterials Transactions
54
6
DOI
出版ステータスPublished - 2013 6 18
外部発表はい

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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