抄録
The hardness of the soft gold electrodeposited from the thiosulfate-sulfite mixed ligand with which we developed recently, has previously been found to increase with increasing sulfur content of the gold deposit. In the present study the mechanism of the sulfur inclusion was investigated by analyzing for sulfur gold deposits produced under various experimental conditions and also by observing weight gains resulting from the adsorption of sulfur-containing species on gold using the quartz crystal microbalance (QCM) technique. The results led us to conclude that the origin of the included sulfur is primarily the adsorbed Au(I)-thiosulfate species, (Au 2S 2O 3) ads, formed as an intermediate in the gold deposition reaction.
| 本文言語 | English |
|---|---|
| ページ（範囲） | C659-C662 |
| ジャーナル | Journal of the Electrochemical Society |
| 巻 | 148 |
| 号 | 10 |
| DOI | |
| 出版ステータス | Published - 2001 10月 1 |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 再生可能エネルギー、持続可能性、環境
- 表面、皮膜および薄膜
- 電気化学
- 材料化学
UN SDG
この成果は、次の持続可能な開発目標に貢献しています
