Metal wiring on flexible origami structure for stable resistance value against deformation

Takuya Uchida*, Hiroki Yasuga, Eiji Iwase, Hiroaki Onoe

*この研究の対応する著者

研究成果: Conference contribution

抄録

This paper describes a new approach to fabricate a flexible circuit that has stable electric resistance value against deformation. The flexible circuit is fabricated by depositing metal wiring on a folded flexible origami structure. We confirmed that the resistance value of the metal wiring on the origami structure was stable against stretching and bending compared to that of the wiring formed on a simple elastic flexible sheet. Using this origami structure, we demonstrated a simple wearable device that fits a wrist. We believe that this origami-based flexible device could be a one possible route to robust and stable wearable devices that can be freely and largely expanded.

本文言語English
ホスト出版物のタイトル23rd International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2019
出版社Chemical and Biological Microsystems Society
ページ201-202
ページ数2
ISBN(電子版)9781733419000
出版ステータスPublished - 2019
イベント23rd International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2019 - Basel, Switzerland
継続期間: 2019 10 272019 10 31

出版物シリーズ

名前23rd International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2019

Conference

Conference23rd International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2019
国/地域Switzerland
CityBasel
Period19/10/2719/10/31

ASJC Scopus subject areas

  • バイオエンジニアリング
  • 化学工学(その他)

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