Micro-cone-shaped Au-bump by gas deposition method for high-density interconnection of LSI chips

Fumito Imura, Hiroshi Nakagawa, Katsuya Kikuchi, Yasuhiro Yamaji, Tokihiko Yokoshima, Masahiro Aoyagi, So Baba, Jun Akedo

研究成果: Conference contribution

2 引用 (Scopus)

抜粋

The technology of bump connections with high-density and reliability has been developed for 3D packaging of LSI and MEMS devices. A tapered bump has high potential to the bump connections. We focus attention on the formation of the tapered bump with self-forming, simple, and high-throughput process by a photolithography and a gas deposition (GD) method. The thickness photoresist of the holes pattern, which is formed by the photolithography, is used as the mask pattern against the deposition of the Au nanoparticles in the GD method. The deposited Au nanoparticles also horizontally grow so that the shaded mask is gradually formed along edge of the holes pattern, and completely cover in the holes. The micro-cone-shaped Au bump can be automatically formed.

元の言語English
ホスト出版物のタイトル4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008
ページ269-271
ページ数3
出版物ステータスPublished - 2008 12 1
外部発表Yes
イベント4th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2008 - Munich, Germany
継続期間: 2008 4 212008 4 24

出版物シリーズ

名前4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008

Other

Other4th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2008
Germany
Munich
期間08/4/2108/4/24

ASJC Scopus subject areas

  • Hardware and Architecture
  • Ceramics and Composites

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  • これを引用

    Imura, F., Nakagawa, H., Kikuchi, K., Yamaji, Y., Yokoshima, T., Aoyagi, M., Baba, S., & Akedo, J. (2008). Micro-cone-shaped Au-bump by gas deposition method for high-density interconnection of LSI chips. : 4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008 (pp. 269-271). (4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008).