Micro flow devices

Shuichi Shoji, Masayoshi Esashi

研究成果: Paper

10 被引用数 (Scopus)

抄録

Micro flow devices of microvalves, micropumps developed very recently are introduced from the point of view of the actuating principle. Since such micro flow devices have multi-level stack structures of the wafers, the bonding methods play a very important role in the fabrication. The silicon-to-glass and the silicon-to-silicon anodic bonding methods using a sputtered Pyrex glass intermediate layer were studied to realize multi-level stacks. A time-of-flight type flow sensor was fabricated and tested.

本文言語English
ページ89-95
ページ数7
出版ステータスPublished - 1994 12 1
イベントProceedings of the 1994 5th International Symposium on Micro Machine and Human Science Proceedings - Nagoya, Jpn
継続期間: 1994 10 21994 10 4

Other

OtherProceedings of the 1994 5th International Symposium on Micro Machine and Human Science Proceedings
CityNagoya, Jpn
Period94/10/294/10/4

ASJC Scopus subject areas

  • Mechanical Engineering

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