Micro flow devices of microvalves, micropumps developed very recently are introduced from the point of view of the actuating principle. Since such micro flow devices have multi-level stack structures of the wafers, the bonding methods play a very important role in the fabrication. The silicon-to-glass and the silicon-to-silicon anodic bonding methods using a sputtered Pyrex glass intermediate layer were studied to realize multi-level stacks. A time-of-flight type flow sensor was fabricated and tested.
|出版ステータス||Published - 1994 12 1|
|イベント||Proceedings of the 1994 5th International Symposium on Micro Machine and Human Science Proceedings - Nagoya, Jpn|
継続期間: 1994 10 2 → 1994 10 4
|Other||Proceedings of the 1994 5th International Symposium on Micro Machine and Human Science Proceedings|
|Period||94/10/2 → 94/10/4|
ASJC Scopus subject areas
- Mechanical Engineering