Microfabrication of electro- and electroless-deposition and its application in the electronic field

Tetsuya Osaka*, Nao Takano, Tokihiko Yokoshima

*この研究の対応する著者

研究成果: Article査読

28 被引用数 (Scopus)

抄録

The recent topics of our researches concerned with the electrochemical fabrication process of highly functionalized metal thin films and minute structures are reviewed. We present three topics; the soft magnetic materials of Co alloys by electro- and electroless- plating, the micro-dot formation by Ni electroless deposition, and fabrication of barrier layer on SiO2 by electroless deposition for ULSI technology. The magnetic property of electrodeposited CoNiFe film was deteriorated by the co-deposition of a small amount of sulfur, whereas the carbon co-deposition improved resistivity of the film. The electroless soft magnetic materials were also proposed for future extremely high-density recording system. As the fine dot formation, the electroless deposition processes for producing fine metal structures were demonstrated. For advanced nano-scale patterning technology, an organic monolayer directly grafted to the Si surface was applied to a novel process of selective metal deposition. Another type of organic monolayer, a self-assembled monolayer of organosilane, was also utilized as an adhesive/catalytic layer for fabrication of a diffusion barrier layer on SiO2 for future ULSI technology.

本文言語English
ページ(範囲)1-7
ページ数7
ジャーナルSurface and Coatings Technology
169-170
DOI
出版ステータスPublished - 2003 6月 2

ASJC Scopus subject areas

  • 化学 (全般)
  • 凝縮系物理学
  • 表面および界面
  • 表面、皮膜および薄膜
  • 材料化学

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