Miniature integrated capacitive pressure sensor

Yoshinori Matsumoto, Shuichi Shoji, Masayoshi Esashi

研究成果: Paper査読

6 被引用数 (Scopus)

抄録

A miniature integrated silicon capacitive pressure sensor has been fabricated. The pressure sensor consists of a Pyrex glass and a silicon chip. A silicon diaphragm and a CMOS capacitance to frequency converter are integrated on the same silicon chip. The silicon chip is hermetically sealed by the Pyrex glass using anodic bonding in wafer process. The sensor capacitor is formed by the silicon diaphragm and a counter metal electrode on the Pyrex glass. The output frequency is detected by the current change in power line. The pressure sensor has higher sensitivity, lower temperature drift and lower power consumption than the conventional piezoresistive pressure sensor.

本文言語English
ページ701-704
ページ数4
出版ステータスPublished - 1990 12 1
外部発表はい
イベント22nd International Conference on Solid State Devices and Materials - Sendai, Jpn
継続期間: 1990 8 221990 8 24

Other

Other22nd International Conference on Solid State Devices and Materials
CitySendai, Jpn
Period90/8/2290/8/24

ASJC Scopus subject areas

  • 工学(全般)

フィンガープリント

「Miniature integrated capacitive pressure sensor」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル