Morphology Control of Cu Added Electrodeposited Bi-Sb-Te Thick Films for Micro-Thermoelectric Devices

研究成果: Conference contribution

抄録

In this research, bismuth and tellurium based thermoelectric materials are studied and electrodeposition method was adapted to fabricate the devices. To improve the thermoelectric performance, the thickness of the patterned films was attempted to be increased up to 30 μm. Film properties, such as morphology, composition, resistivity and thermoelectric output, of p-type Cu-added Bi-Sb-Te films were investigated. It was found that the thermoelectric properties were improved with an increase in the film thickness. An annealed buffer layer was created as substrate to control the morphology of Bi-Sb-Te films to be more compact and denser. Finally, 30 μm thick p-type Bi-Sb-Te patterned-films were successfully fabricated, indicating the applicability to micro-thermoelectric devices.

本文言語English
ホスト出版物のタイトルSelected Proceedings from the 237th ECS Meeting with the 18th International Meeting on Chemical Sensors, IMCS 2020
出版社Institute of Physics Publishing
ページ877-883
ページ数7
7
ISBN(電子版)9781607685395
DOI
出版ステータスPublished - 2020 4 1
イベント237th ECS Meeting with the 18th International Meeting on Chemical Sensors, IMCS 2020 - Montreal, Canada
継続期間: 2020 5 102020 5 14

出版物シリーズ

名前ECS Transactions
番号7
97
ISSN(印刷版)1938-6737
ISSN(電子版)1938-5862

Conference

Conference237th ECS Meeting with the 18th International Meeting on Chemical Sensors, IMCS 2020
CountryCanada
CityMontreal
Period20/5/1020/5/14

ASJC Scopus subject areas

  • Engineering(all)

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