Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding

Mikiko Saito, Kaori Matsunaga, Jun Mizuno, Hroshi Nishikawa

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

We investigated a low-temperature bond formation process, wherein nanoporous structures were formed on electrode surfaces by electrodeposition and dealloying. The morphology control of a nanoporous Au-Ag structure was investigated using electrochemical deposition and electrochemical methods. The ligament size of the electrodeposited Au-Ag films after dealloying increased upon annealing. The ligament size of 10-20 nm for as-deposited increased to 50-100 nm for films annealed at 150 °C. The samples that were annealed at 50 °C before dealloying indicated a finer nanoporous structure, which corresponded to the highest bond strength of the evaluated samples. The volume of selective dissolution was small on as-deposited samples despite the anodic current being the largest of the examined films. Inductively coupled plasma mass spectrometry (ICP-MS) analysis showed that the change of the Ag content of the films after dealloying of as-deposited samples was the smallest of the examined films. Small ligament size with a finer nanoporous structure resulted in high bond strength.

本文言語English
ホスト出版物のタイトルProceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781479940264
DOI
出版ステータスPublished - 2014 11 18
イベント5th Electronics System-Integration Technology Conference, ESTC 2014 - Helsinki, Finland
継続期間: 2014 9 162014 9 18

出版物シリーズ

名前Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014

Conference

Conference5th Electronics System-Integration Technology Conference, ESTC 2014
国/地域Finland
CityHelsinki
Period14/9/1614/9/18

ASJC Scopus subject areas

  • 制御およびシステム工学
  • 電子工学および電気工学

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