Non-cyanide electroless gold plating using polyphenols as reducing agents

Yutaka Ohtani, Aiko Horiuchi, Aritomo Yamaguchi, Kenichi Oyaizu, Makoto Yuasa

研究成果: Article査読

12 被引用数 (Scopus)

抄録

Polyphenol compounds were investigated as reducing agents for non-cyanide electroless gold plating for electronics assembly applications. The pH value and temperature were optimized to determine the conditions that lead to a high deposition rate without precipitation. The surface morphology was evaluated by scanning electron microscopy. Catechol, pyrogallol, and gallic acid yielded deposited films with good appearance and solderability under the optimized conditions. Among the tested reducing agents, catechol is the most suitable for use as a stable plating bath with a long life. It has a moderate reducing ability to stabilize the bath and deposit the film. The calculated values of the heat of formation and the highest occupied molecular orbital levels of the reducing agents supported the experimental results.

本文言語English
ページ(範囲)C63-C66
ジャーナルJournal of the Electrochemical Society
153
1
DOI
出版ステータスPublished - 2006 4 10
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

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