A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.
|出版ステータス||Published - 2013 1 1|
|イベント||2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan|
継続期間: 2013 11 11 → 2013 11 13
|Conference||2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013|
|Period||13/11/11 → 13/11/13|
ASJC Scopus subject areas
- Electrical and Electronic Engineering