Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

Weixin Fu, Jun Mizuno, Shuichi Shoji, Takashi Kasahara, Akiko Okada, Shugo Ishizuka

研究成果: Paper査読

抄録

A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.

本文言語English
DOI
出版ステータスPublished - 2013 1 1
イベント2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan
継続期間: 2013 11 112013 11 13

Conference

Conference2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
国/地域Japan
CityKyoto
Period13/11/1113/11/13

ASJC Scopus subject areas

  • 電子工学および電気工学

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