Novel flip-chip bonding technology using chemical process

Yasuhiro Yamaji*, Tokihiko Yokoshima, Hirotaka Oosato, Noboru Igawa, Yuichiro Tamura, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi

*この研究の対応する著者

研究成果: Conference contribution

8 被引用数 (Scopus)

抄録

Reductions of bonding temperature and bonding pressure are regarded as key challenges for higher interconnection-density packages in recent years. To avoid negative factors caused by mechanical process such as thermal stress and mechanical damage of the device circuits, we have developed novel flip-chip bonding technology using electroless NiB plating of the chemical process. Bump connection of 2D pattern using electroless NiB plating was realized by controlling extraneous deposition, which is deposited on insulator layer without catalyst. The potential of the novel flip-chip bonding technology using controlled extraneous deposition of the electroless NiB plating was experimentally demonstrated using 20μm-pitch flip-chip test vehicle.

本文言語English
ホスト出版物のタイトルProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
ページ898-904
ページ数7
DOI
出版ステータスPublished - 2007 10月 22
外部発表はい
イベント57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
継続期間: 2007 5月 292007 6月 1

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷版)0569-5503

Conference

Conference57th Electronic Components and Technology Conference 2007, ECTC '07
国/地域United States
CitySparks, NV
Period07/5/2907/6/1

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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