Novel flip-chip bonding technology using chemical process

Yasuhiro Yamaji, Tokihiko Yokoshima, Hirotaka Oosato, Noboru Igawa, Yuichiro Tamura, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi

研究成果: Conference contribution

8 引用 (Scopus)

抜粋

Reductions of bonding temperature and bonding pressure are regarded as key challenges for higher interconnection-density packages in recent years. To avoid negative factors caused by mechanical process such as thermal stress and mechanical damage of the device circuits, we have developed novel flip-chip bonding technology using electroless NiB plating of the chemical process. Bump connection of 2D pattern using electroless NiB plating was realized by controlling extraneous deposition, which is deposited on insulator layer without catalyst. The potential of the novel flip-chip bonding technology using controlled extraneous deposition of the electroless NiB plating was experimentally demonstrated using 20μm-pitch flip-chip test vehicle.

元の言語English
ホスト出版物のタイトルProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
ページ898-904
ページ数7
DOI
出版物ステータスPublished - 2007 10 22
外部発表Yes
イベント57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
継続期間: 2007 5 292007 6 1

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷物)0569-5503

Conference

Conference57th Electronic Components and Technology Conference 2007, ECTC '07
United States
Sparks, NV
期間07/5/2907/6/1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

フィンガープリント Novel flip-chip bonding technology using chemical process' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Yamaji, Y., Yokoshima, T., Oosato, H., Igawa, N., Tamura, Y., Kikuchi, K., Nakagawa, H., & Aoyagi, M. (2007). Novel flip-chip bonding technology using chemical process. : Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07 (pp. 898-904). [4249991] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2007.373905