Novel type of conductive paste using functionally gradient Ag-Cu powder

T. Hori, A. Otani, Y. Ogura, M. Nakamura, H. Matsuda, J. Sato

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

The novel type of conductive paste has been developed and the application of it has been investigated. In this paper, two types of conductive paste are introduced. One is Polymer thick film type, which should be cured at 150-220 °C. The other is Cermet thick film type, which should be fired at 600 °C or 900 °C. The applications of them are printed circuit pattern, EMI shield, conductive layers for soldering, electrode, hybrid integrated circuit, and so on. On these types of pastes, the specific structure of Ag-Cu alloy powder has an important role for the excellent performances. Ag component is highly concentrated on the surface and its concentration gradually decreases from the surface into the inner part. This unique structure has made it possible to realize an excellent durability (especially oxidation resistance), sufficient adhesion strength, and least ionmigration comparable to existing Cu paste. In addition, the distribution of the powder size is suitable for the conductive paste. In using as the PTF paste, high electroconductivity comparable to Ag has been obtained. And in using as the CTF paste, the excellent sintering property at comparatively low temperature has been exhibited. In this paper, at first, the unique characteristics of Ag-Cu powder will be shown and some examples of application will be described.

本文言語English
ホスト出版物のタイトルProceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium
出版社IEEE
ページ337-341
ページ数5
出版ステータスPublished - 1997
外部発表はい
イベントProceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium - Tokyo, Jpn
継続期間: 1997 4 161997 4 18

Other

OtherProceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium
CityTokyo, Jpn
Period97/4/1697/4/18

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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