Numerical Investigation of Metal Insulation Technique on Turn-to-Turn Contact Resistance of REBCO Pancake Coils

So Noguchi, Ryosuke Miyao, Katsutoshi Monma, Hajime Igarashi, Atsushi Ishiyama

研究成果: Article査読

8 被引用数 (Scopus)

抄録

No-insulation (NI) REBCO pancake coils show high thermal stability, however the charging delay is an issue. Hence, to improve the charging delay, it was proposed that a stainless steel (SUS) tape was cowound between turns, called 'metal-as-insulation' or 'metal-insulation (MI),' to increase the turn-to-turn contact resistivity. The MI technique could make the turn-to-turn contact resistivity approximately 50 times large compared to a conventional NI REBCO pancake coil. This paper reports a bypass current behavior on the cross section of MI REBCO pancake coil using two-dimensional finite element method. The influence of the SUS tape thickness, the MI material, and the number of SUS tapes on the turn-to-turn contact resistivity is investigated. As the result, it is clarified that the turn-to-turn contact resistivity strongly depends on the surface condition and number of SUS tapes.

本文言語English
論文番号7817744
ジャーナルIEEE Transactions on Applied Superconductivity
27
4
DOI
出版ステータスPublished - 2017 6

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 電子工学および電気工学

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