On-chip optical interconnect

Keishi Ohashi*, Kenichi Nishi, Takanori Shimizu, Masafumi Nakada, Junichi Fujikata, Jun Ushida, Sunao Toru, Koichi Nose, Masayuki Mizuno, Hiroaki Yukawa, Masao Kinoshita, Nobuo Suzuki, Akiko Gomyo, Tsutomu Ishi, Daisuke Okamoto, Katsuya Furue, Toshihide Ueno, Tai Tsuchizawa, Toshifumi Watanabe, Koji YamadaSei Ichi Itabashi, Jun Akedo

*この研究の対応する著者

研究成果: Article査読

95 被引用数 (Scopus)

抄録

We describe a cost-effective and low-powerconsumption approach for on-chip optical interconnection. This approach includes an investigation into architectures, devices, and materials. We have proposed and fabricated a bonded structure of an si-based optical layer on a large-scale integration (LSI) chip. The fabricated optical layer contains Si nanophotodiodes for optical detectors, which are coupled with SiON waveguides using surface-plasmon antennas. Optical signals were introduced to the optical layer and distributed to the Si nanophotodiodes. The output signals from the photodiodes were sent electrically to the transimpedance-amplifier circuitries in the LSI. The signals from the photodiodes triggered of the circuitries at 5 GHz. since electrooptical modulators consume the most power in on-chip optical interconnect systems and require a large footprint, they are critical to establish on-chip optical interconnection. Two approaches are investigated: l) an architecture using a fewer number of modulators and 2) high electrooptical coefficient materials.

本文言語English
論文番号5075754
ページ(範囲)1186-1196
ページ数11
ジャーナルProceedings of the IEEE
97
7
DOI
出版ステータスPublished - 2009 7
外部発表はい

ASJC Scopus subject areas

  • コンピュータ サイエンス(全般)
  • 電子工学および電気工学

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