TY - GEN
T1 - On the length of THRU standard for TRL de-embedding on Si substrate above 110 GHz
AU - Orii, A.
AU - Suizu, M.
AU - Amakawa, S.
AU - Katayama, K.
AU - Takano, K.
AU - Motoyoshi, M.
AU - Yoshida, T.
AU - Fujishima, M.
PY - 2013
Y1 - 2013
N2 - It is known that the THRU standard (a transmission line) used for thru-reflect-line (TRL) calibration/de-embedding for S-parameter measurement has to be long enough that only a single electromagnetic mode propagates at its center for it to work reliably. But ideally, TRL standards should occupy as little precious silicon real estate as possible. This paper attempts to experimentally find out how long a THRU is long enough above 110GHz up to 170 GHz through measurements of transmission lines of various lengths. The results indicate that the length of a THRU should be at least 400 micrometers, excluding pads and pad-to-line transitions.
AB - It is known that the THRU standard (a transmission line) used for thru-reflect-line (TRL) calibration/de-embedding for S-parameter measurement has to be long enough that only a single electromagnetic mode propagates at its center for it to work reliably. But ideally, TRL standards should occupy as little precious silicon real estate as possible. This paper attempts to experimentally find out how long a THRU is long enough above 110GHz up to 170 GHz through measurements of transmission lines of various lengths. The results indicate that the length of a THRU should be at least 400 micrometers, excluding pads and pad-to-line transitions.
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U2 - 10.1109/ICMTS.2013.6528150
DO - 10.1109/ICMTS.2013.6528150
M3 - Conference contribution
AN - SCOPUS:84881113300
SN - 9781467348485
T3 - IEEE International Conference on Microelectronic Test Structures
SP - 81
EP - 86
BT - 2013 IEEE International Conference on Microelectronic Test Structures, ICMTS 2013 - Conference Proceedings
T2 - 2013 International Conference on Microelectronic Test Structures, ICMTS 2013
Y2 - 25 March 2013 through 28 March 2013
ER -