Optimized negative thermal expansion induced by gradual intermetallic charge transfer in Bi1-xSbxNiO3

Takumi Nishikubo, Yuki Sakai, Kengo Oka, Masaichiro Mizumaki, Tetsu Watanuki, Akihiko Machida, Naoyuki Maejima, Shigenori Ueda, Takashi Mizokawa, Masaki Azuma*

*この研究の対応する著者

研究成果: Article査読

9 被引用数 (Scopus)

抄録

Negative thermal expansion (NTE) induced by intermetallic charge transfer between Bi5+ and Ni2+ was observed in Bi1-xSbxNiO3 (x = 0.05 and 0.10). Bi3+ and Bi5+ had a long-range ordering in the low-temperature phase of Bi0.95Sb0.05NiO3 while the ordering was short-range in Bi0.9Sb0.01NiO3. The latter compound exhibited a continuous NTE with a linear coefficient of thermal expansion (CTE) of αL = %106 ppmK%1 without temperature hysteresis in a wide temperature range of 200-320 K.

本文言語English
論文番号061102
ジャーナルApplied Physics Express
11
6
DOI
出版ステータスPublished - 2018 6

ASJC Scopus subject areas

  • 工学(全般)
  • 物理学および天文学(全般)

フィンガープリント

「Optimized negative thermal expansion induced by gradual intermetallic charge transfer in Bi<sub>1-x</sub>Sb<sub>x</sub>NiO<sub>3</sub>」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル