Origins of sample-surface contaminants in loadlock chamber

Akira Kurokawa, Shingo Ichimura, Ken Nakamura, Hiroshi Itoh

研究成果: Article査読

抄録

The sample contamination in a loadlock chamber, caused by particle sticking, adsorption of gas and moisture in a loadlock chamber and back stream from pumping systems, was investigated. In order to eliminate the first two sources of contamination, a clean silicon sample was prepared in a glove box filled with particle-free nitrogen gas, and the sample was transferred to the loadlock chamber without exposing to air. To observe the contamination during pumping, the last source of contamination, a clean sample was set in the loadlock chamber and after evacuation surface contaminant was evaluated by C1s intensity of XPS spectra. Several evacuation procedures were compared and we concluded that oil-free pumping system is essentially important for contaminant-free introduction of a clean sample.

本文言語English
ページ(範囲)247-250
ページ数4
ジャーナルShinku/Journal of the Vacuum Society of Japan
43
3
DOI
出版ステータスPublished - 2000
外部発表はい

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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