Packing of submicrometer-sized polystyrene particles within the micrometer-sized recessed patterns on silicon substrate

Manabu Tanaka, Naonobu Shimamoto, Takashi Tanii, Iwao Ohdomari, Hiroyuki Nishide

研究成果: Article査読

16 被引用数 (Scopus)

抄録

The packing of submicrometer-sized polystyrene particles within the micrometer-sized recessed patterns were achieved using silicon-microfabricated substrates and a simple dipping and pulling-up process. The polystyrene particles were selectively deposited within the micrometer-sized square, triangular, or circular recessed patterns by tuning the experimental conditions during the pulling-up process. The process produced a capillary force, i.e., a gas-liquid interfacial tension, to push the particles into the recessed patterns on the substrate. In most cases, the selectively depositing particles within the recessed patterns self-organically formed the closest packing structures. However, a special phenomenon, cubic packing structures of the particles, was observed when using square patterns with a few times larger side-length than the particle diameters. Several particle packing structures within different-sized square patterns were demonstrated, and the relationship between the particle packing structures and square pattern sizes were discussed.

本文言語English
ページ(範囲)451-455
ページ数5
ジャーナルScience and Technology of Advanced Materials
7
5
DOI
出版ステータスPublished - 2006 7

ASJC Scopus subject areas

  • Materials Science(all)

フィンガープリント 「Packing of submicrometer-sized polystyrene particles within the micrometer-sized recessed patterns on silicon substrate」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル