TY - JOUR
T1 - Physical and chemical analytical instruments for failure analyses in G-bit devices
AU - Mitsui, Yasuhiro
AU - Yano, Fumiko
AU - Nakamura, Yoshitaka
AU - Kimoto, Koji
AU - Hasegawa, Tsuyoshi
AU - Kimura, Shigeharu
AU - Asayama, Kyoichiro
PY - 1998
Y1 - 1998
N2 - The current status and future trend of analytical instruments are discussed. Analytical instruments for failure analyses in sub-1/4 micron dimensions or less, require high spatial resolution and sensitivity at atomic levels. Using new analytical instruments, such as the Nano-prober for electrical characteristics inspection in actual circuits, TEM-EELS for chemical bond analysis of nanometer area and GDS for precise composition analysis, it was found that a SiO2 or TiOx film formed by water from titanic acid (TiOxH2O) produced with titan, water and chlorine, was a cause of high resistivity for a contact (CVD-W/CVD-TiN/Ti/Si) in sub-1/4 micron devices.
AB - The current status and future trend of analytical instruments are discussed. Analytical instruments for failure analyses in sub-1/4 micron dimensions or less, require high spatial resolution and sensitivity at atomic levels. Using new analytical instruments, such as the Nano-prober for electrical characteristics inspection in actual circuits, TEM-EELS for chemical bond analysis of nanometer area and GDS for precise composition analysis, it was found that a SiO2 or TiOx film formed by water from titanic acid (TiOxH2O) produced with titan, water and chlorine, was a cause of high resistivity for a contact (CVD-W/CVD-TiN/Ti/Si) in sub-1/4 micron devices.
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M3 - Conference article
AN - SCOPUS:0032265854
SN - 0163-1918
SP - 329
EP - 332
JO - Technical Digest - International Electron Devices Meeting
JF - Technical Digest - International Electron Devices Meeting
T2 - Proceedings of the 1998 IEEE International Electron Devices Meeting
Y2 - 6 December 1998 through 9 December 1998
ER -