Plate-laminated corporate-feed slotted waveguide array antenna at 350-GHz band by silicon process

Karim Tekkouk, Jiro Hirokawa, Kazuki Oogimoto, Tadao Nagatsuma, Hiroyuki Seto, Yoshiyuki Inoue, Mikiko Saito

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

A corporate feed slotted waveguide array antenna with broadband characteristics in term of gain in the 350 GHz band is achieved by measurement for the first time. The etching accuracy for thin laminated plates of the diffusion bonding process with conventional chemical etching is limited to ±20μm. This limits the use of this process for antenna fabrication in the submillimeter wave band where the fabrication tolerances are very severe. To improve the etching accuracy of the thin laminated plates, a new fabrication process has been developed. Each silicon wafer is etched by DRIE (deep reactive ion etcher) and is plated by gold on the surface. This new fabrication process provides better fabrication tolerances about ±5 μm using wafer bond aligner. The thin laminated wafers are then bonded with the diffusion bonding process under high temperature and high pressure. To validate the proposed antenna concepts, an antenna prototype has been designed and fabricated in the 350 GHz band. The 3dB-down gain bandwidth is about 44.6 GHz by this silicon process while it was about 15GHz by the conventional process using metal plates in measurement.

本文言語English
ホスト出版物のタイトルISAP 2016 - International Symposium on Antennas and Propagation
出版社Institute of Electrical and Electronics Engineers Inc.
ページ538-539
ページ数2
ISBN(電子版)9784885523137
出版ステータスPublished - 2017 1 17
イベント21st International Symposium on Antennas and Propagation, ISAP 2016 - Ginowan, Okinawa, Japan
継続期間: 2016 10 242016 10 28

出版物シリーズ

名前ISAP 2016 - International Symposium on Antennas and Propagation

Other

Other21st International Symposium on Antennas and Propagation, ISAP 2016
国/地域Japan
CityGinowan, Okinawa
Period16/10/2416/10/28

ASJC Scopus subject areas

  • 放射線
  • コンピュータ ネットワークおよび通信
  • 器械工学

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