Practical integration method of active devices on SOI photonic integrated circuits

Tomohiro Kita, Masahiro Abe, Yasuo Ohtera, Hirohito Yamada

研究成果: Conference contribution

3 引用 (Scopus)

抄録

We propose a method of mounting LD chips on SOI substrate and discuss about the optical coupling loss between LDs and Si photonic-wire waveguides. In our scheme, light output from an LD is coupled to the optical waveguides through spot-size-converters (SSC). The simulations show that a minimum optical coupling loss of 1.6 dB and an offset tolerance of ±0.7 μm for the LD chip positioning can be achieved. We measured the optical coupling loss, confirming the validity of the simulations.

元の言語English
ホスト出版物のタイトル2010 7th IEEE International Conference on Group IV Photonics, GFP 2010
ページ275-277
ページ数3
DOI
出版物ステータスPublished - 2010 12 1
外部発表Yes
イベント2010 7th IEEE International Conference on Group IV Photonics, GFP 2010 - Beijing, China
継続期間: 2010 9 12010 9 3

Other

Other2010 7th IEEE International Conference on Group IV Photonics, GFP 2010
China
Beijing
期間10/9/110/9/3

Fingerprint

Photonics
Integrated circuits
Optical waveguides
Mountings
Waveguides
Wire
Substrates

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Ceramics and Composites
  • Electronic, Optical and Magnetic Materials

これを引用

Kita, T., Abe, M., Ohtera, Y., & Yamada, H. (2010). Practical integration method of active devices on SOI photonic integrated circuits. : 2010 7th IEEE International Conference on Group IV Photonics, GFP 2010 (pp. 275-277). [5643354] https://doi.org/10.1109/GROUP4.2010.5643354

Practical integration method of active devices on SOI photonic integrated circuits. / Kita, Tomohiro; Abe, Masahiro; Ohtera, Yasuo; Yamada, Hirohito.

2010 7th IEEE International Conference on Group IV Photonics, GFP 2010. 2010. p. 275-277 5643354.

研究成果: Conference contribution

Kita, T, Abe, M, Ohtera, Y & Yamada, H 2010, Practical integration method of active devices on SOI photonic integrated circuits. : 2010 7th IEEE International Conference on Group IV Photonics, GFP 2010., 5643354, pp. 275-277, 2010 7th IEEE International Conference on Group IV Photonics, GFP 2010, Beijing, China, 10/9/1. https://doi.org/10.1109/GROUP4.2010.5643354
Kita T, Abe M, Ohtera Y, Yamada H. Practical integration method of active devices on SOI photonic integrated circuits. : 2010 7th IEEE International Conference on Group IV Photonics, GFP 2010. 2010. p. 275-277. 5643354 https://doi.org/10.1109/GROUP4.2010.5643354
Kita, Tomohiro ; Abe, Masahiro ; Ohtera, Yasuo ; Yamada, Hirohito. / Practical integration method of active devices on SOI photonic integrated circuits. 2010 7th IEEE International Conference on Group IV Photonics, GFP 2010. 2010. pp. 275-277
@inproceedings{fe9c5c211aae40c6bf97f405ab62d1bc,
title = "Practical integration method of active devices on SOI photonic integrated circuits",
abstract = "We propose a method of mounting LD chips on SOI substrate and discuss about the optical coupling loss between LDs and Si photonic-wire waveguides. In our scheme, light output from an LD is coupled to the optical waveguides through spot-size-converters (SSC). The simulations show that a minimum optical coupling loss of 1.6 dB and an offset tolerance of ±0.7 μm for the LD chip positioning can be achieved. We measured the optical coupling loss, confirming the validity of the simulations.",
author = "Tomohiro Kita and Masahiro Abe and Yasuo Ohtera and Hirohito Yamada",
year = "2010",
month = "12",
day = "1",
doi = "10.1109/GROUP4.2010.5643354",
language = "English",
isbn = "9781424463442",
pages = "275--277",
booktitle = "2010 7th IEEE International Conference on Group IV Photonics, GFP 2010",

}

TY - GEN

T1 - Practical integration method of active devices on SOI photonic integrated circuits

AU - Kita, Tomohiro

AU - Abe, Masahiro

AU - Ohtera, Yasuo

AU - Yamada, Hirohito

PY - 2010/12/1

Y1 - 2010/12/1

N2 - We propose a method of mounting LD chips on SOI substrate and discuss about the optical coupling loss between LDs and Si photonic-wire waveguides. In our scheme, light output from an LD is coupled to the optical waveguides through spot-size-converters (SSC). The simulations show that a minimum optical coupling loss of 1.6 dB and an offset tolerance of ±0.7 μm for the LD chip positioning can be achieved. We measured the optical coupling loss, confirming the validity of the simulations.

AB - We propose a method of mounting LD chips on SOI substrate and discuss about the optical coupling loss between LDs and Si photonic-wire waveguides. In our scheme, light output from an LD is coupled to the optical waveguides through spot-size-converters (SSC). The simulations show that a minimum optical coupling loss of 1.6 dB and an offset tolerance of ±0.7 μm for the LD chip positioning can be achieved. We measured the optical coupling loss, confirming the validity of the simulations.

UR - http://www.scopus.com/inward/record.url?scp=78651371680&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78651371680&partnerID=8YFLogxK

U2 - 10.1109/GROUP4.2010.5643354

DO - 10.1109/GROUP4.2010.5643354

M3 - Conference contribution

AN - SCOPUS:78651371680

SN - 9781424463442

SP - 275

EP - 277

BT - 2010 7th IEEE International Conference on Group IV Photonics, GFP 2010

ER -