Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications

Norihiro Togasaki, Yutaka Okinaka, Takayuki Homma, Tetsuya Osaka*

*この研究の対応する著者

研究成果: Article査読

29 被引用数 (Scopus)

抄録

A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.

本文言語English
ページ(範囲)882-887
ページ数6
ジャーナルElectrochimica Acta
51
5
DOI
出版ステータスPublished - 2005 11 10

ASJC Scopus subject areas

  • 化学工学(全般)
  • 電気化学

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