Preparation of Ni-Sn Alloys by an Electroless-Deposition Method

Hidenori Shimauchi, Keiu Tamura, Tetsuya Osaka

研究成果: Article査読

18 被引用数 (Scopus)

抄録

Electroless-deposited Ni-Sn alloy films were investigated to increase tin content in the deposit. The maximum tin contents of electroless Ni-Sn-P and Ni-Sn-B were ca. 30 atom percent (a/o) and 42 a/o, respectively. The maximum tin content in the case of Ni-Sn-B was nearly equal to that of electrodeposited Ni-Sn alloy already reported. The crystallinity of Ni-Sn-P and Ni-Sn-B alloys was raised up with an increase in tin content. The corrosion resistance of Ni-Sn-P and Ni-Sn-B alloys was between that of amorphous and crystalline electroless-deposited Ni-P. Codeposition of tin into Ni-P films improved solderability but into the Ni-B films, the solderability of Ni-Sn-B films situated in the region between those of Ni-P and NiB, because the solderability of NiB is higher.

本文言語English
ページ(範囲)1471-1476
ページ数6
ジャーナルJournal of the Electrochemical Society
141
6
DOI
出版ステータスPublished - 1994 6

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

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