A novel strategy to fabricate the copper pattern by electroless copper plating was investigated. The photolithographic negative patterns were fabricated by using the hybrid films with the palladium nanoparticles. The palladium nanoparticles in photo-cured acrylate thin films were an effective catalyst for the electroless copper plating, and it was easily to form the catalysis fine patterns by UV irradiation and development. Addition of silica nanoparticles to the hybrid thin films enhanced the performance of catalyst for the electroless copper plating and adhesion between the thin film and deposited copper.
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