Preparation of photo-curing acrylate thin films containing Pd nanoparticles and their application for electroless plating catalysts

Takashi Hamada*, Seiji Watase, Yukihito Matsuura, Hiroshi Kondo, Noboru Nishioka, Kimihiro Matsukawa

*この研究の対応する著者

研究成果: Article査読

3 被引用数 (Scopus)

抄録

A novel strategy to fabricate the copper pattern by electroless copper plating was investigated. The photolithographic negative patterns were fabricated by using the hybrid films with the palladium nanoparticles. The palladium nanoparticles in photo-cured acrylate thin films were an effective catalyst for the electroless copper plating, and it was easily to form the catalysis fine patterns by UV irradiation and development. Addition of silica nanoparticles to the hybrid thin films enhanced the performance of catalyst for the electroless copper plating and adhesion between the thin film and deposited copper.

本文言語English
ページ(範囲)137-140
ページ数4
ジャーナルJournal of Photopolymer Science and Technology
20
1
DOI
出版ステータスPublished - 2007
外部発表はい

ASJC Scopus subject areas

  • ポリマーおよびプラスチック
  • 有機化学
  • 材料化学

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