We studied the proximity gettering of heavy metals by secondary defects, using high-energy, high-dose ion implantation by means of intentional contamination of samples with copper and iron. It was demonstrated that the secondary defects induced by high-energy boron or silicon implantation can act as gettering sites of heavy metals and reduce the junction leakage current. Proximity gettering by silicon implantation is found to be more effective than that by boron implantation. Moreover it is found to be difficult to getter iron atoms in comparison with copper atoms.
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