Quench propagation properties in HTS pancake coil

S. Shimizu, Atsushi Ishiyama, S. B. Kim

    研究成果: Article

    12 引用 (Scopus)

    抄録

    In this paper, we present the results of experiments and computer simulations to make clear the quench propagation properties in Bi-2223/Ag superconducting multifilament tape. We developed a computer code based on the two-dimensional finite element method (2-D FEM). Computed voltage and temperature traces during a quench agree well with the experimentally recorded voltage and temperature traces. Good agreement validates the computer code, making a useful tool in developing protection strategies for high-temperature superconducting (HTS) coils. Therefore, we simulate the quench process in a single pancake coil wound with Bi-2223/Ag superconducting multifilament tape with background magnetic filed up to 10 T at 20 K using the developed computer code. The quench propagation properties and stability in HTS coils are discussed and compare with those in low-temperature superconducting (LTS) coils.

    元の言語English
    ページ(範囲)1077-1080
    ページ数4
    ジャーナルIEEE Transactions on Applied Superconductivity
    9
    発行部数2 PART 1
    DOI
    出版物ステータスPublished - 1999

    Fingerprint

    coils
    propagation
    Superconducting tapes
    computer programs
    tapes
    Temperature
    electric potential
    Finite element method
    Electric potential
    finite element method
    computerized simulation
    temperature
    Superconducting coils
    Computer simulation
    simulation
    Experiments

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Physics and Astronomy (miscellaneous)

    これを引用

    Quench propagation properties in HTS pancake coil. / Shimizu, S.; Ishiyama, Atsushi; Kim, S. B.

    :: IEEE Transactions on Applied Superconductivity, 巻 9, 番号 2 PART 1, 1999, p. 1077-1080.

    研究成果: Article

    Shimizu, S. ; Ishiyama, Atsushi ; Kim, S. B. / Quench propagation properties in HTS pancake coil. :: IEEE Transactions on Applied Superconductivity. 1999 ; 巻 9, 番号 2 PART 1. pp. 1077-1080.
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