Random walk algorithm for large thermal RC network analysis

Jun Guo*, Sheqin Dong, Satoshi Goto

*この研究の対応する著者

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

The heat diffusion model of IC chip is equivalent to electrical resistors and capacitors (RC) network. Instead of using direct methods to solve the network equations, a novel statistical method based on random walk techniques was proposed for thermal RC network analysis in this paper. The corresponding 2 dimension temperature distribution was derived finally. Experimental results show the simulation results are accurate enough to satisfy the error margin and the proposed method is much faster than the general method for large scale network analysis.

本文言語English
ホスト出版物のタイトルASICON 2009 - Proceedings 2009 8th IEEE International Conference on ASIC
ページ771-774
ページ数4
DOI
出版ステータスPublished - 2009
イベント2009 8th IEEE International Conference on ASIC, ASICON 2009 - Changsha
継続期間: 2009 10月 202009 10月 23

Other

Other2009 8th IEEE International Conference on ASIC, ASICON 2009
CityChangsha
Period09/10/2009/10/23

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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