Relationship between bonding conditions and strength for joints using a Au nanoporous sheet

Kaori Matsunaga, Min Su Kim, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

As the establishment of high-temperature lead-free solders and other interconnection technologies is an urgent priority in the electronics industry, a strong drive exists to find Pb-free alternatives for high-temperature bonding processes. We propose a no-solvent, no-flux solid-state bonding technique that uses a nanoporous sheet, a process we call nanoporous bonding (NPB). Nanoporous sheets can be made from binary alloys by selective dissolution of one element. In this study, Au nanoporous sheets were fabricated by dealloying a Au-Ag binary alloy with nitric acid. The effects of joining conditions on the shear strength of joints using this sheet were investigated. The joints bonded at 350 °C showed high shear strengths of above 20 MPa. It was found that joining using Au NPB was successfully achieved, and that NPB shows potential as a Pb-free interconnection material for high-temperature electronic applications.

本文言語English
ホスト出版物のタイトルESTC 2014 - 5th Electronics System-Integration Technology Conference
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781479940264
DOI
出版ステータスPublished - 2014 11 18
イベント5th Electronics System-Integration Technology Conference, ESTC 2014 - Helsinki, Finland
継続期間: 2014 9 162014 9 18

出版物シリーズ

名前ESTC 2014 - 5th Electronics System-Integration Technology Conference

Conference

Conference5th Electronics System-Integration Technology Conference, ESTC 2014
国/地域Finland
CityHelsinki
Period14/9/1614/9/18

ASJC Scopus subject areas

  • 制御およびシステム工学
  • 電子工学および電気工学

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