Relationships of design parameters and the cooling performance of the spiral-fin heatsink

Shingo Otake, Motohito Hori, Ryoichi Kato, Yoshinari Ikeda, Victor Parque, Muhammad Khairi Faiz, Makoto Yoshida, Tomoyuki Miyashita

研究成果: Conference contribution

抄録

Due to the demand for miniaturization, further improvement in cooling performance is required for power modules. The spiral-fin heatsink we considered has higher cooling performance than conventional ones. In this paper, we examined the design parameters of the spiral-fin, and found that three parameters of spiral-fin have big effect for the cooling performance .

本文言語English
ホスト出版物のタイトル2021 International Conference on Electronics Packaging, ICEP 2021
出版社Institute of Electrical and Electronics Engineers Inc.
ページ161-162
ページ数2
ISBN(電子版)9784991191114
DOI
出版ステータスPublished - 2021 5 12
イベント20th International Conference on Electronics Packaging, ICEP 2021 - Tokyo, Japan
継続期間: 2021 5 122021 5 14

出版物シリーズ

名前2021 International Conference on Electronics Packaging, ICEP 2021

Conference

Conference20th International Conference on Electronics Packaging, ICEP 2021
国/地域Japan
CityTokyo
Period21/5/1221/5/14

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 材料力学
  • 電子材料、光学材料、および磁性材料
  • 器械工学

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