Requirements for ductile-mode machining based on deformation analysis of mono-crystalline silicon by molecular dynamics simulation

H. Tanaka*, S. Shimada, L. Anthony

*この研究の対応する著者

研究成果: Article査読

90 被引用数 (Scopus)

抄録

To obtain scientific guidelines for ductile-mode machining, nano-mdentation, nano-bending, and nanomachining of defect-free mono-crystalline silicon are investigated by molecular dynamics simulation. Results show that amorphous phase transformation of silicon is a key mechanism for inelastic deformation, and stable shearing of the amorphous is necessary for ductile-mode machining. Stress analysis suggests that stable shearing takes place under a compressive stress field. In practice, a sharp cutting edge tool with a large negative rake angle should be used for effective ductile-mode machining, and vibration machining should be applied for larger depths of cut as it enlarges the amorphous region in front of the cutting edge.

本文言語English
ページ(範囲)53-56
ページ数4
ジャーナルCIRP Annals - Manufacturing Technology
56
1
DOI
出版ステータスPublished - 2007

ASJC Scopus subject areas

  • 機械工学
  • 産業および生産工学

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