Robustness of CNT via interconnect fabricated by low temperature process over a high-density current
Akio Kawabata*, Shintaro Sato, Tatsuhiro Nozue, Takashi Hyakushima, Masaaki Norimatsu, Miho Mishima, Tomo Murakami, Daiyu Kondo, Koji Asano, Mari Ohfuti, Hiroshi Kawarada, Tadashi Sakai, Mizuhisa Nihei, Yuji Awano
*この研究の対応する著者
研究成果: Conference contribution
47
被引用数
(Scopus)